Printed Electronics Insights: Smart Packaging and IoT


Printed Electronics Insights: Smart Packaging and IoT

Learn about the Internet of Things and its application in Smart Packaging through presentations ranging from packaging companies through to the latest innovations from academia. October 11: company exhibition followed by networking reception and dinner. October 12: full day of talks and panel discussions from leading experts in printed electronics.

Dates 11 Oct 2017 - 12 Oct 2017 - This event is in the past.
Opening times 16:30 11/10/17 - 17:00 12/10/17
Venue Robinson College, Cambridge
Organiser name Mark Leadbeater
Telephone
01223 748345
Email
Website

Event details:

Printed Electronics Insights: Smart Packaging and IoT

The EPSRC Centre for Innovative Manufacturing in Large-Area Electronics at the University of Cambridge is organizing “Printed Electronics Insights: Smart Packaging & IoT”, a day of presentations and a panel discussion. Attendees will learn more on IoT and its application in Smart Packaging in presentations ranging from experiences of packaging companies to the latest innovations from academia. The event will be held on Thursday, October 12, 2017 at Robinson College, Cambridge (UK), with company exhibiton and a networking reception on the day before, joining participants of the 41st OE-A Working Group Meeting (Oct. 10-11, 2017).

Topics covered will include:

  • Smart packaging for mass markets
  • Fuelling the Internet of Everything through printed electronics
  • Electronics on paper
  • Smart Labels for environmental sensing
  • Flexible Power for the IoT
  • Scaling up active and intelligent packaging

The keynote address will be given by Christopher Williams from IBM Watson who will talk about how Augmented Intelligence allows machines to understand human language and recognise images in order to deliver better outcomes and user experiences and explore how connecting this intelligence to smart devices and infrastructure can provide new levels of control and information. Full details of the programme are on the event webpage.

The event is co-organized with the Organic and Printed Electronics Association (OE-A) and follows the 41st OE-A Working Group Meeting (Oct. 10-11, 2017) also being held in Cambridge. It is co-sponsored by FlexTech. Members of OE-A and FlexTech are eligible for a discounted registration rate. 

Registration

  • £250
  • £100 (OE-A members, FlexTech members)

To register  for the event visit the event webpage: http://www-large-area-electronics.eng.cam.ac.uk/event/printed-electronics-insights-smart-packaging-IoT

Cambridge Innovation and Knowledge Centre

Advanced manufacturing technologies for photonics and electronics

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