Topics:
- New Product Introduction
- Simulation
- Design for Manufacturability
- Assembly Qualification
- TC, Age, Vibration & Shock, Humidity & Bias
- Mil, Jedec standards etc
- Supplier qualifications
- Relevant Case Studies
Reasons To Attend:
- New product introduction for electronics, microelectronics and packaging
- How to evaluate designs and introduce a product with built in quality
- The importance of DfM & DfR (Design for Manufacturing and Reliability)
- Understand quality techniques such as SPC (Statistical Process Control)
- Adopting standards, simulation and preventing failures.
