TALKIN’ THINGS will embed PragmatIC’s flexible integrated circuits into its smart packaging solution to bring consumer engagement and brand protection to trillions of products.
TALKIN' THINGS and PragmatIC announce partnership to make trillions of products talk
PragmatIC is pleased to announce a strategic relationship which will help drive the mass market adoption of smart packaging.
TALKIN' THINGS is a global smart packaging solutions provider who works with the world's leading brands and packaging companies to integrate innovative technologies that enable them to engage directly with their consumers through original, personalised marketing campaigns, and measure return on investment using a suite of user friendly tools.
TALKIN' THINGS will embed PragmatIC's flexible integrated circuits (FlexICs) into packaging solutions that will be significantly lower cost than comparable silicon based options, opening up new mass market segments previously inaccessible. In addition, as PragmatIC's new RFID/NFC FlexICs are thinner than a human hair and flexible, they will be imperceptible even in flexible packaging, which is one of the fastest growing packaging format in the home, cosmetic and food/beverage consumer packaged goods (CPGs) industries.
"We are looking forward to working closely with PragmatIC" commented Marcin Pilarz, CEO of TALKIN' THINGS. "They are the first company to bring flexible electronics to market at the price level previously unavailable for smart packaging technologies, and thanks to that TALKIN' THINGS will be able to drive interactivity into a broader range of high volume consumer goods than ever before."
"We are very pleased that TALKIN' THINGS, a global smart packaging solutions provider has chosen to use our unique FlexICs." said Scott White, CEO of PragmatIC. "With their relationships with leading brand owners and packaging companies, TALKIN' THINGS are ideally positioned to take solutions based on our technology to the mass market."
PragmatIC enables printed logic circuits that introduce intelligence and interactivity into a wide range of products and applications, in form factors that are not possible using silicon chips – for example: ultra thin, flexible, robust, transparent, disposable.