CIT flexes its circuits at Advanced Engineering UK 2014

CIT is demonstrating the advantages of low-cost, digitally printed, flexible circuits at Advanced Engineering UK 2014 at the NEC this week.

 

The event (November 11-12) brings together interrelated high value engineering communities: Aero Engineering, Composites Engineering, Automotive Engineering, Auto Electronics and Performance Metals Engineering. There's still time to pre-register.

CIT is in the Feature Area ‘Enabling the Future’ (stand H91) with examples of a range of different types of flexible circuits and their applications. Services like CIT’s rapid PCB prototype manufacturing are invaluable when developing concepts to a deadline. They also deliver the ability to flex to fit into awkward spaces, bond to surfaces and save weight over conventional circuit boards: well suited for both automotive and aviation applications.

This year the event is placing a special focus on the applications potential of two game changing materials and process innovation sectors:

  • Printable Electronics
  • Graphene

CIT presentation

CIT’s Product Engineering Director Steve Thomas will be presenting a session:

When: Tuesday at 15.30-16.00
Where: Forum 5.
Hosted by Knowledge Transfer Network

Future Enablers Through Printed Electronics – Flexible Circuit Technologies

Steve will be speaking on:
Additive Manufacture of Flexible Printed Circuits.

Come and see us on stand H91

Advanced Engineering UK Twitter: @advancedenguk
CIT Twitter:@CITtechnology

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