RFMOD has over 25 years' experience in the design of WLCSP, QFN, Flip-Chip, BGA and MEMS.
RFMOD proprietary packaging technologies target high volume, size /cost critical markets such as mobile phones, ”Smart-power”, "Wearables" and the "Internet of Things".
Andrew Holland, RFMOD Managing Director, announced the service - "Chip / Package / System co-design is critcal to a successful product yet has many pitfalls. RFMOD can assist with all aspects in the process - from chip-floorplanning and IP design through to Multi-project Wafer parts delivery and on to volume production".
To benefit from RFMOD technology and design expertise visit www.rfmod.com
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